Filter Results By:

Products

Applications

Manufacturers

High Speed Cameras

capture images of fast moving objects at rates up to 200M frames per second.


Showing results: 151 - 153 of 153 items found.

  • USB 3.0 Cameras With CCD

    xiD - XIMEA GmbH

    *Quality components - Sony "EXview HAD CCD II" sensors delivering 2.8, 6.1, 9.1 and 12 Mpix*Fastest - Highest speed using full 4 TAP readout potential*Industry standard interface - Compliant with USB 3.0 SuperSpeed specification*Versatile mini camera - Subtle 60 x 60 x 39 mm, 320 grams (1)*Power - Lowest power consumption starting at 3 Watt, bus powered with USB3 cable*Cool - Minimal heat dissipation with passive COOLing*Compatibility - USB 3.0 support for Windows 7 and 10, macOS, Linux, ARM and 30 Libraries*Connectivity and Synchronization - Programmable opto-isolated input and output, 3 status LEDs*Bandwidth potential - 5Gb/s interface 400Mpix/s data throughput*Software interfaces - GenICam / GenTL and highly optimized xiAPI SDK for Image Processing*High grade - Quality class of sensors is combined with specially selected IR filters *Easy deployment - Range of accessories and widest hardware and software interoperability*Highly Customizable - Available in Board level and with Peltier TE Cooling

  • Platform for Multi camera systems and Embedded vision

    xiX - XIMEA GmbH

    *Smallest camera featuring Sony Pregius™ - Compact with only 26.4 x 26.4 x 31 mm and 30 grams (1)*Fast CMOS - High speed, high frame rate: from 2.3 Mpix at 166 Fps to 50 Mpix at 33 Fps*Cool economy - Low power consumption with under 3 Watt and minimal heat dissipation*All-around support - support for Windows 7 and 10, macOS, Linux, ARM and embedded platforms*Industry standard - Data and control interface complies with PCI Express External Cabling Specifications*Adaptable potential - Available with two flat ribbon flex cable connectors: parallel and perpendicular *Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Connectivity and Synchronization - Programmable opto-isolated input and output, 4 status LEDs*Lens control - EF-mount Interface allows remote control of aperture, focus and image stabilization*Highly Customizable - Variety of sensor options including Sony IMX287, IMX273, IMX249, IMX265, IMX264, IMX267, IMX304 available in board level stack for OEM use and with switches and adapters*Interoperability increase - Continuous embrace of new software and hardware partners*Cost efficient - Excellent value through utilization of the newest technologies including Sony Pregius™

  • Automated Programmer Superpro Sb05

    Xeltek

    ※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput:4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning:Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers: 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices:Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time:I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software:Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control:Remote project loading, quality monitoring, volume control, file security.

Get Help